i ntegrated c ircuits d ivision lba127 dual single-pole, combination optomos ? relay www.ixysic.com ds-lba127-r12 1 part # description lba127 8-pin dip (50/tube) lba127p 8-pin flatpack (50/tube) lba127ptr 8-pin flatpack (1000/reel) lba127s 8-pin surface mount (50/tube) LBA127STR 8-pin surface mount (1000/reel) parameter ratings units blocking voltage 250 v p load current 200 ma rms / ma dc on-resistance (max) 10 ? applications features description approvals ordering information pin configuration ? 3750v rms input/output isolation ? low drive power requirements (ttl/cmos compatible) ? high reliability ? arc-free with no snubbing circuits ? fcc compatible ? vde compatible ? no emi/rfi generation ? small 8-pin package ? machine insertable, wave solderable ? surface mount, tape & reel version available ? telecommunications ? telecom switching ? tip/ring circuits ? modem switching (laptop, notebook, pocket size) ? hook switch ? dial pulsing ? ground start ? ringing injection ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? medical equipment-patient/equipment isolation ? security ? aerospace ? industrial controls lba127 is a combination device comprising one normally open (1-form-a) and one normally closed (1-form-b) solid state relay. both relays are independent, 250v, 200ma, 10 ? devices designed to provide an ideal solution where a complementary relay pair (1-form-a / 1-form-b) is required. e 3 pb switching characteristics of normally closed (form b) devices switching characteristics of normally open (form a) devices 1 2 3 4 8 7 6 5 + control - normally closed C control - normally closed + control - normally open C control - normally open normally closed pole normally open pole form-a i f i load 10% 90% t on t off form-b i f 10% 90% i load t on t off ? ul recognized component: file e76270 ? csa certified component: certificate 1175739 ? en/iec 60950-1 certified component: tuv certificate b 09 07 49410 004
i ntegrated c ircuits d ivision www.ixysic.com 2 r12 lba127 absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. parameter conditions symbol min typ max units output characteristics load current continuous 1 -i l - - 200 ma rms / ma dc peak t = 10ms i lpk - - 400 ma p on-resistance 2 i l =200ma r on - 6.8 10 ? off-state leakage current v l =250v p i leak --1 ? a switching speeds turn-on i f =5ma, v l =10v t on --5 ms turn-off t off --5 output capacitance v l =50v, f=1mhz c out - 110 - pf input characteristics input control current to activate i l =200ma i f --5 ma input control current to deactivate - i f 0.4 0.7 - ma input voltage drop i f =5ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r --10 ? a common characteristics input to output capacitance - c i/o -3- pf 1 if both poles operate simultaneously, then the load current must be derated so as not to exceed the package power dissipation value. 2 measurement taken within 1 second of on-time. parameter ratings units blocking voltage 250 v p reverse input voltage 5 v input control current 50 ma peak (10ms) 1 a input power dissipation 1 150 mw total power dissipation 2 800 mw isolation voltage, input to output 3750 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 1.33 mw / c 2 derate linearly 6.67 mw / c absolute maximum ratings @ 25c electrical characteristics @ 25c
i ntegrated c ircuits d ivision lba127 www.ixysic.com 3 r12 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. form-a/form-b performance data @25oc (unless otherwise noted)* typical led forward voltage drop (n=50, i f =5ma) 35 30 25 20 15 10 5 0 1.18 1.20 1.22 1.24 1.26 led forward voltage drop (v) device count (n) typical i f for switch operation (n=50, i l =200ma dc ) led current (ma) device count (n) 25 20 15 10 5 0 0.35 0.45 0.55 0.40 0.50 0.60 typical blocking voltage distribution (form-a: i f =0ma, form-b: i f =5ma) (n=50) 25 20 15 10 5 0 332 334 336 340 338 342 blocking voltage (v p ) device count (n) temperature (oc) -40 -20 0 20 40 60 80 100 led forward voltage drop (v) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 typical led forward voltage drop vs. temperature i f =5ma i f =10ma i f =20ma i f =50ma temperature (oc) -40 -20 0 20 40 60 80 100 led current (ma) 0.40 0.45 0.50 0.55 0.60 0.65 typical i f for switch operation vs. temperature (i l =100ma dc ) temperature (oc) -40 -20 0 20 40 60 80 100 blocking voltage (v p ) 315 320 325 330 335 340 345 350 355 typical blocking voltage vs. temperature (form-a: i f =0ma, form-b: i f =5ma) temperature (oc) -40 -20 0 20 40 60 80 100 load current (ma) 0 50 100 150 200 250 load current vs. load temperature (form-a: i f =5ma, form-b: i f =0ma) energy rating curve time load current (a) 1.2 1.0 0.8 0.6 0.4 0.2 0 10 p s 100 p s 1ms 10ms 100ms 1s 10s 100s
i ntegrated c ircuits d ivision www.ixysic.com 4 r12 lba127 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. form-a relay performance data @25oc (unless otherwise noted)* form-a typical turn-on time (n=50, i f =5ma, i l =200ma dc ) 0.33 0.39 0.45 0.30 0.36 0.42 turn-on time (ms) device count (n) 25 20 15 10 5 0 form-a typical turn-off time (n=50, i f =5ma, i l =200ma dc ) 0.13 0.15 0.14 0.16 turn-off time (ms) device count (n) 25 20 15 10 5 0 0.17 0.12 form-a typical on-resistance distribution (n=50, i f =5ma, i l =200ma dc ) 25 20 15 10 5 0 6.70 6.80 6.90 6.75 6.85 6.95 on-resistance ( : ) device count (n) temperature (oc) -40 -20 0 20 40 60 80 100 turn-on time (ms) 0 0.2 0.4 0.6 0.8 1.0 1.2 form-a typical turn-on time vs. temperature (i f =5ma, i l =100ma dc ) temperature (oc) -40 -20 0 20 40 60 80 100 turn-off time (ms) 0.08 0.10 0.12 0.14 0.16 0.18 0.20 form-a typical turn-off time vs. temperature (i f =5ma, i l =100ma dc ) temperature (oc) -40 -20 0 20 40 60 80 100 on-resistance ( : ) 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 form-a typical on-resistance vs. temperature (i f =5ma, i l =100ma dc ) led forward current (ma) 0 1020304050 turn-on time (ms) 0 0.50 1.00 form-a typical turn-on time vs. led forward current (i l =100ma dc ) 0.25 0.75 led forward current (ma) 0 1020304050 turn-off time (ms) 0.150 0.155 0.160 0.165 form-a typical turn-off time vs. led forward current (i l =100ma dc ) load voltage (v) -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 load current (a) -0.20 -0.15 -0.10 -0.05 0.00 0.05 0.10 0.15 0.20 form-a typical load current vs. load voltage (i f =5ma) temperature (oc) -40 -20 0 20 40 60 80 100 leakage ( p a) 0.000 0.005 0.010 0.015 0.020 0.025 form-a typical leakage vs.temperature (measured across pins 5 & 6) (v l =250v)
i ntegrated c ircuits d ivision lba127 www.ixysic.com 5 r12 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. form-b relay performance data @25oc (unless otherwise noted)* form-b typical turn-on time (n=50, i f =5ma, i l =200ma dc ) turn-on time (ms) device count (n) 25 20 15 10 5 0 0.03 0.07 0.11 0.05 0.09 0.13 form-b typical turn-off time (n=50, i f =5ma, i l =200ma dc ) turn-off time (ms) device count (n) 25 20 15 10 5 0 0.75 1.75 2.75 1.25 2.25 3.25 form-b typical on-resistance distribution (n=50, i f =0ma, i l =200ma dc ) on-resistance ( : ) device count (n) 25 20 15 10 5 0 4.05 4.65 5.25 4.35 4.95 5.55 form-b typical turn-on time vs. temperature (i f =5ma, i l =100ma dc ) temperature (oc) turn-on time (ms) 0.20 0.15 0.10 0.05 0 -40 0 40 -20 20 60 80 100 form-b typical turn-off time vs. temperature (i l =100ma dc ) temperature (oc) turn-off time (ms) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 0 40 -20 20 60 80 100 i f =5ma i f =10ma i f =20ma form-b typical on-resistance vs. temperature (i f =0ma, i l =100ma dc ) temperature (oc) on-resistance ( : ) 9 8 7 6 5 4 3 2 1 0 -40 0 40 -20 20 60 80 100 form-b typical turn-on time vs. led forward current (i l =100ma dc ) led forward current (ma) turn-on time ( p s) 78.5 78.0 77.5 77.0 76.5 76.0 01020 5 15 253035 40 45 50 form-b typical turn-off time vs. led forward current (i l =100ma dc ) led forward current (ma) turn-off time (ms) 2.5 2.0 1.5 1.0 0.5 0 01020 5 15 253035 40 45 50 form-b typical load current vs. load voltage (i f =0ma) load voltage (v) load current (ma) 200 150 100 50 0 -50 -100 -150 -200 -1 -0.6 -0.2 -0.8 -0.4 0 0.2 0.4 0.6 0.8 1 temperature (oc) -40 -20 0 20 40 60 80 100 leakage ( p a) 0 0.01 0.02 0.03 0.04 0.05 0.06 form-b typical leakage vs. temperature measured across pins 7&8 (i f =5ma)
i ntegrated c ircuits d ivision www.ixysic.com 6 r12 lba127 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating lba127 / lba127s / lba127p msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time lba127 / lba127s 250oc for 30 seconds lba127p 260oc for 30 seconds board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated circuits division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine- or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used. e 3 pb
i ntegrated c ircuits d ivision lba127 www.ixysic.com 7 r12 mechanical dimensions lba127 lba127s lba127p dimensions mm (inches) pcb hole pattern 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 9.144 0.508 (0.360 0.020) 0.457 0.076 (0.018 0.003) 9.652 0.381 (0.380 0.015) 7.239 typ. (0.285) 7.620 0.254 (0.300 0.010) 4.064 typ (0.160) 0.813 0.102 (0.032 0.004) 8-0.800 dia. (8-0.031 dia.) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) 7.620 0.127 (0.300 0.005) 6.350 0.127 (0.250 0.005) 3.302 0.051 (0.130 0.002) pin 1 0.254 0.0127 (0.010 0.0005) dimensions mm (inches) pcb land pattern 9.398 0.127 (0.370 0.005) 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 7.620 0.254 (0.300 0.010) 0 min / 0.102 max (0 min / 0.004 max) 2.286 max. (0.090 max.) 0.203 0.013 (0.008 0.0005) 0.635 0.127 (0.025 0.005) 9.652 0.381 (0.380 0.015) 0.457 0.076 (0.018 0.003) 2.159 0.025 (0.085 0.001) 2.54 (0.10) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 0.864 0.120 (0.034 0.004) pin 1 dimensions mm (inches) pcb land pattern 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 6.350 0.127 (0.250 0.005) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) 0.813 0.102 (0.032 0.004) 4.445 0.127 (0.175 0.005) 7.620 0.254 (0.300 0.010) 0.635 0.127 (0.025 0.005) 0.254 0.0127 (0.010 0.0005) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 0.051 (0.130 0.002) pin 1
i ntegrated c ircuits d ivision specification: ds-lba127-r12 ?copyright 2012, ixys integrated circuits division optomos ? is a registered trademark of ixys integrated circuits division all rights reserved. printed in usa. 12/22/2012 for additional information please visit our website at: www.ixysic.com 8 lba127 ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infri ngement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. mechanical dimensions LBA127STR tape & reel lba127ptr tape & reel dimensions mm (inches) user direction of feed notes: 1. dimensions carry tolerances of eia standard 481-2 2. tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 embossment embossed carrier top cover tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) k 1 =4.20 (0.165) 0 k =4.90 (0.193) p=12.00 (0.472) w=16.00 (0.63) bo=10.30 (0.406) ao=10.30 (0.406) dimensions mm (inches) notes: 1. all dimensions carry tolerances of eia standard 481-2 2. the tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 embossment embossed carrier top cover tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) user direction of feed p = 12.00 (0.472) w = 16.00 (0.63) bo = 10.30 (0.406) ao = 10.30 (0.406) k 1 = 2.00 (0.079) k 0 = 2.70 (0.106) 7.50 (0.295) 2.00 (0.079) 4.00 (0.157)
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